HP Synergy 660 Gen10 CTO Compute Module – With warranty and technical service for installation or support.
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HP Synergy 660 Gen10 Product Description
The HP Synergy 660 Gen10 Compute Module delivers increased performance and scalability for your demanding, data-intensive enterprise workloads. The powerful Intel® Xeon® Scalable family of processors (2- or 4-socket), large memory footprint (up to 6 TB of HP DDR4 memory in 48 DIMM slots), and flexible I/O configuration give large workloads, such as structured databases and business processing applications, the compute power and memory support they demand.
What's New in HP Synergy 660 Gen10
- Next-generation processors from Intel's scalable family.
- New 2933 MT/s memory for the next generation of Intel's scalable family of processors.
- New HP persistent memory optimized for data-intensive workloads with Intel Optane DC persistent memory.
- Additional drive systems and replacements.
Highly flexible – composite/software defined infrastructure
The HP Synergy 660 Gen10 Compute Module delivers more performance, capacity, efficiency, and flexibility to power most workloads with support for the full range of 2nd generation Intel Xeon Scalable family processors.
- Composable compute resource that is intelligently auto-discovered, easily provisioned, and integratedly managed. Synergy Composability simplifies IT operations and reduces over-provisioning costs.
- OneView Integrated – RESTful API with an ecosystem of composable infrastructure partners provides extensive options for third-party integration while protecting existing core investments.
Optimal performance for increasing workloads
The HP Synergy Gen10 Compute Module delivers a performance boost over the previous generation with a choice of 2 generations of Intel Scalable Family processors.
- Increased memory speeds with a wide range of memory sizes for registered and off-load DDR4 DIMMs.
- Faster compute for network connectivity speeds get your data where it's needed faster.
Flexible and Secure
The HP Synergy 660 Gen10 Compute Module delivers superior, enterprise-grade availability that enables IT to implement changes quickly and confidently through model-based operations.
- Unmatched threat protection with HP Silicon Root of Trust and a unique chain of trust architecture to protect, detect, and recover firmware.
- System tuning to create smooth performance while matching customer workloads
- Up to 6 mezzanine options with enough I/O and redundancy for workloads that require high availability.
- 160 zoned drives per storage controller, framed and hybrid RAID / HBA Smart Array to make your controller investment more effective.
Características do produto
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Overview
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Processors 1
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Two or four of the following depending on the model
Scalable Processor Family Intel Xeon – 2nd Generation
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chipset
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Intel C621 Series Chipset
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synergy management 2
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HPE composer with OneView technology
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On the compute management chipset 3
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HPE iLO 5 ASIC
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Memory 4, 5, 6, 7
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HPE Registered Dual Inline Memory Module (RDIMMs) and Load Reduction Dual Inline Memory Module (LRDIMMs)
Two to forty-eight (48) of the following, depending on the model. The following memory is compatible with the 2nd generation geraçãoIntel xeon family of scalable processors:
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The following memory is compatible with the 1st generation Intel xeon family of scalable processors:
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Modes of Operation
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New memory class that can be configured as large server memory or fast storage.
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memory protection 8
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Network adapters 11
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Mezzanine Connectors
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Six (6) mezzanine I/O expansion connectors:
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Mezzanine options include
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HPE Computing Module Read-only memory (ROM)
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Inventory controllers
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Maximum internal storage 9
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Models
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Capacity
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Asset
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Hot Plug SFF SAS SSD
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61,2 TB
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4 x 15,3 TB
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Hot plug SFF SATA SSD
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15,36 TB
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4 x 3,84 TB
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Hot Plug SFF SAS HDD
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9,6 TB
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4 x 2,4 TB
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Hot Plug SFF SATA HDD
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8,0 TB
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4 x 2,0 TB
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Hot Plug SFF NVMe SSD
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d16.0TB
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GB x 8 4,0
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Hot Plug UFF SATA SSD
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2,72 TB
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GB x 4 340
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Internal M.2 hot plug
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7,68 TB
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4 x 1,92 TB
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Interfaces
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Micro SDHC slot
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One (1) built-in high capacity digital secure micro card slot (Micro SDHC).
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3.0 USB port
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One (1) internal USB 3.0 connector for USB flash media drive keys.
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3.0 USB port
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One (1) external USB 3.0 connector for USB flash media drive keys.
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iLO USB 2.0 port
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One (1) external USB 2.0 connector for iLO 5.
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Form factor
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The HPE Synergy 660 Gen10 is a full-height, single-width 10U compute module that connects to the 12000 frame of the HPE Synergy.
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Frames
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The HPE Synergy 12000 frame is the foundation for all Synergy products and supports full redundancy in a single frame, while allowing scalability and redundancy for many frames (up to 21 frames supported per single composer / OneView).
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Industry standard compliance
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Recorders
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Integrated matrox G200eH2 video standard with 16MB of video RAM
HPE iLO 5 in system management memory
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HPE UEFI Server / ROM 10 legacy
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UEFI is an industry standard that provides better management and more secure configuration than legacy ROM when interacting with the user server at boot time. HPE Gen10 servers have a UEFI Class 2 implementation and support UEFI mode (default) and legacy BIOS mode.
UEFI enables several new features specific to HPE Synergy compute modules, such as:
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UEFI boot mode only:
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Integrated management
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USB 3.0 battery
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Safety
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Standard security features
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NOTE:
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Software overview
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Overview
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Operating system and virtualization software support
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NOTE: the OS support may change. For the most up-to-date information, go to the HPE OS Support Matrix page: |
Physical Specifications
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Dimensions (H x W x D) (with frame)
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Weight (approximate)
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Electrical Specifications
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Overview
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Power Specifications
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For power specifications, including input requirements, BTU rating, and power supply output, see the HPE Synergy Board TechSpecs.
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Environmental Specifications
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System inlet temperature
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Operating Temperature
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Out of operation temperature
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-30° to 60°C (-22° to 140°F). The maximum rate of change is 20°C/hr (36°F/hr)
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Extended ambient operation support
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For approved hardware configurations, the supported system input range is extended to be: 5° to 10°C (41° to 50°F) and 35° to 40°C (95° to 104°F) at the sea with an altitude reduction of 1,0°C for every 175 m (1,8°F for every 574 ft) above 900 m (2953 ft) to a maximum of 3050 m (10.000 ft)
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Relative humidity (non-condensing)
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operational relative humidity
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Minimum should be the highest (Most Humidity) of -12°C (10,4°F) dew point or 8% relative humidity. The maximum should be the lower dew point (less humidity) of 24 °C (75,2 °F) or 90% relative humidity
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Relative humidity out of operation
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5% to 95% relative humidity (Rh), maximum wet bulb temperature of 38,7 °C (101,7 °F), non-condensing
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Altitude
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Operating altitude
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3050 m (10.000 ft). This value can be limited by the type and number of options installed. The maximum allowable altitude change rate is 457 m/min (1500 ft/min)
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non-operational altitude
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9144 m (30.000 ft). The maximum allowable altitude change rate is 457 m/min (1500 ft/min)
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Third-Party Maintenance for HP End-of-Life (EOL) and HP End-of-Service-Life (EOSL)
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