HP Synergy 660 Gen10 CTO Compute Module – With warranty and technical service for installation or support.
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Product Description HP Synergy 660 Gen10
The HP Synergy 660 Gen10 Compute Module delivers increased performance and scalability for your demanding, data-intensive enterprise workloads. The powerful Intel® Xeon® Scalable family of processors (2 or 4 sockets), wide memory footprint (up to 6 TB of HP DDR4 memory in 48 DIMM slots), and flexible I/O configuration delivers large workloads, such as structured databases and business processing applications, the computing power and memory support they require.
What’s new in HP Synergy 660 Gen10
- Next generation of processors from Intel’s Scalable family.
- New 2933 MT/s memory for the next generation of processors in Intel’s Scalable family.
- New HP persistent memory optimized for data-intensive workloads with Intel Optane DC persistent memory.
- Additional drive systems and replacements.
Highly flexible – composed/software-defined infrastructure
The HP Synergy 660 Gen10 Compute Module offers more performance, capacity, efficiency, and flexibility options to power most workloads with support for the full 2-generation range of Intel Xeon Scalable family processors.
- Composable compute resource that is intelligently autodiscovered, easily provisioned, and seamlessly managed. Synergy Composability simplifies IT operations and reduces over-provisioning costs.
- Integrated OneView – RESTful API with an ecosystem of composable infrastructure partners provides extensive options for third-party integration, protecting existing key investments.
Optimal performance for growing workloads
The HP Synergy Gen10 Compute Module offers a performance boost over the previous generation with a choice of 2 generations of processors from the Intel Scalable family.
- Increased memory speeds with a wide range of memory sizes for registered, load-reduced DDR4 DIMMs.
- Faster compute for network connectivity speeds gets your data where it’s needed faster.
Flexible and Secure
The HP Synergy 660 Gen10 Compute Module delivers superior enterprise-grade availability that enables IT to implement change quickly and confidently through model-based operations.
- Unmatched threat protection with HP Silicon Root of Trust and a unique chain of trust architecture to protect, detect, and recover firmware.
- System tuning to create smooth performance while matching customer workloads
- Up to 6 mezzanine options with sufficient I/O and redundancy for workloads that require high availability.
- 160 storage-controller-zoned, framed, and hybrid RAID drives/Smart Array HBA to make your controller investment more effective.
Product Features
Characteristic
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Description
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Processors 1
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Two or four of the following, depending on the model
2nd Generation Intel Xeon Scalable Processor Family
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Chipset
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Chipset Intel C621 Series
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HPE composer 2
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Synergy Management
with OneView Technology
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On the Compute Management Chipset 3
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HPE iLO 5 ASIC
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Memory 4, 5, 6, 7
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HPE Registered Inline Dual Memory Module (RDIMMs) and Load Shedding Inline Dual Memory Module (LRDIMMs)
Two to forty-eight (48) of the following, depending on model. The following memory is compatible with the 2nd Generation Intel xeon Scalable processor family:
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The following memory is compatible with the 1st Gen Intel xeon Scalable processor family:
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Modes of operation
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New class of memory that can be configured as large server memory or fast storage.
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Memory Protection 8
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Network Adapters 11
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Mezzanine Connectors
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Six (6) I/O expansion mezzanine connectors:
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Mezzanine options include
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HPE Compute Module Read-Only Memory (ROM)
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Inventory controllers
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Maximum internal storage 9
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Models Capacity
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Configuration
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Hot plug SFF SAS SSD
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61.2 TB
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4 x 15.3 TB
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Hot plug SFF SATA SSD
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15.36TB
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4 x 3.84TB
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Hot plug SFF SAS HDD
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9.6 TB
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4 x 2.4 TB
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Hot plug SFF SATA HDD
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8.0 TB
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4 x 2.0 TB
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Hot Plug SFF NVMe SSD
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d16.0TB
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8 x 4.0GB
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Hot Plug uFF SATA SSD
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2.72TB
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4 x 340GB
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Internal
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M.2 Hot Plug
7.68TB
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4 x 1.92TB
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Interfaces
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Slot Micro SDHC
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One (1) internal high-capacity digital secure micro card slot (Micro SDHC).
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USB 3.0 port
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One (1) internal USB 3.0 connector for USB flash drive keys.
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USB 3.0 port
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One (1) external USB 3.0 connector for USB flash drive keys.
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iLO USB 2.0 port
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One (1) external USB 2.0 connector for iLO 5.
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Form factor
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The HPE Synergy 660 Gen10 is a single-width, full-height 10U compute module that connects to the HPE Synergy 12000 frame.
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Frames
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The HPE Synergy 12000 frame is the foundation for all Synergy products and supports full redundancy within a single frame, while enabling scalability and redundancy for many frames (up to 21 frames supported per single compositor/OneView).
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Industry standard compliance
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Graphics
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Integrated matrox G200eH2 video standard with 16 MB of video RAM
HPE iLO 5 in System Management Memory
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HPE UEFI / ROM 10 Legacy Server
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UEFI is an industry standard that provides better management and more secure configuration than legacy ROM when interacting with the user server at boot time. HPE Gen10 servers have a UEFI Class 2 implementation and support both UEFI (default) mode and legacy BIOS mode.
UEFI enables several new features specific to HPE Synergy compute modules, such as:
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UEFI boot mode only:
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Integrated management
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USB 3.0
battery
provisioning |
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Safety
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Standard security features
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NOTE:
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Software Overview
Feature
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Description
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Operating system and virtualization software support
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NOTE: Operating system support may change. For the most up-to-date information, go to the HPE OS support matrix page: |
Physical Specifications
Feature
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Description
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Dimensions (H x W x D) (with frame)
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Weight (approx)
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Electrical Specifications
Feature
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Description
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Power Specifications
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For power specifications, including input, BTU rating, and power supply output requirements, refer to the HPE Synergy Frame TechSpecs.
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Environmental Specifications
Feature
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Description
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System Inlet Temperature
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Operating Temperature
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Temperature out of operation
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-30° to 60°C (-22° to 140°F). The maximum rate of change is 20°C/hr (36°F/hr)
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Extended ambient operation support
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For approved hardware configurations, the input range of the supported system is extended to be: 5° to 10°C (41° to 50°F) and 35° to 40°C (95° to 104°F) at sea level with an altitude reduction of 1.0°C per 175 m (1.8 °F per 574 ft) above 900 m (2953 ft) up to a maximum of 3050 m (10,000 ft)
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Relative humidity (non-condensing)
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Operating relative humidity
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Minimum should be the highest (most humidity) of -12 °C (10.4 °F) dew point or 8% relative humidity. The maximum should be the lower dew point (less humidity) of 24 °C (75.2 °F) or 90% relative humidity
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Relative humidity out of operation
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5% to 95% relative humidity (Rh), maximum wet-bulb temperature of 38.7 °C (101.7 °F), non-condensing
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Altitude
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Operating Altitude
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3050 m (10,000 ft). This value may be limited by the type and number of options installed. The maximum allowable altitude change rate is 457 m/min (1500 ft/min)
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Non-operating altitude
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9144 m (30,000 ft). The maximum allowable altitude change rate is 457 m/min (1500 ft/min)
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