HP Synergy 660 Gen10 CTO Compute Module

$9.999.999,00

Warranty: up to 12 months

SKU 660-gen10 Category Brand:

HP Synergy 660 Gen10 CTO Compute Module – With warranty and technical service for installation or support.

 

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– SPARE PARTS AVAILABLE FOR EACH MODEL. SEE PRICE FOR spare units, controllers, power supplies, network cards, HBAs, SFPs, cables, etc.

Product Description HP Synergy 660 Gen10

The HP Synergy 660 Gen10 Compute Module delivers increased performance and scalability for your demanding, data-intensive enterprise workloads. The powerful Intel® Xeon® Scalable family of processors (2 or 4 sockets), wide memory footprint (up to 6 TB of HP DDR4 memory in 48 DIMM slots), and flexible I/O configuration delivers large workloads, such as structured databases and business processing applications, the computing power and memory support they require.

What’s new in HP Synergy 660 Gen10

  • Next generation of processors from Intel’s Scalable family.
  • New 2933 MT/s memory for the next generation of processors in Intel’s Scalable family.
  • New HP persistent memory optimized for data-intensive workloads with Intel Optane DC persistent memory.
  • Additional drive systems and replacements.

Highly flexible – composed/software-defined infrastructure

The HP Synergy 660 Gen10 Compute Module offers more performance, capacity, efficiency, and flexibility options to power most workloads with support for the full 2-generation range of Intel Xeon Scalable family processors.

  • Composable compute resource that is intelligently autodiscovered, easily provisioned, and seamlessly managed. Synergy Composability simplifies IT operations and reduces over-provisioning costs.
  • Integrated OneView – RESTful API with an ecosystem of composable infrastructure partners provides extensive options for third-party integration, protecting existing key investments.

Optimal performance for growing workloads

The HP Synergy Gen10 Compute Module offers a performance boost over the previous generation with a choice of 2 generations of processors from the Intel Scalable family.

  • Increased memory speeds with a wide range of memory sizes for registered, load-reduced DDR4 DIMMs.
  • Faster compute for network connectivity speeds gets your data where it’s needed faster.

Flexible and Secure

The HP Synergy 660 Gen10 Compute Module delivers superior enterprise-grade availability that enables IT to implement change quickly and confidently through model-based operations.

  • Unmatched threat protection with HP Silicon Root of Trust and a unique chain of trust architecture to protect, detect, and recover firmware.
  • System tuning to create smooth performance while matching customer workloads
  • Up to 6 mezzanine options with sufficient I/O and redundancy for workloads that require high availability.
  • 160 storage-controller-zoned, framed, and hybrid RAID drives/Smart Array HBA to make your controller investment more effective.

Product Features

Characteristic
Description
Processors 1
Two or four of the following, depending on the model
Intel Xeon Models
CPU Frequency (GHz)
Cores
Power (WATTs)
UPI
DDR4 MT/s
Per-socket memory
Platinum Processors
Platinum 8180M Processor
2.5 GHz
28
205 W
3 @ 10.4 GT/s
2666 MT/s
1.5 TB
Platinum 8180 Processor
2.5 GHz
28
205 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Platinum 8176 Processor
2.1 GHz
28
165 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Platinum 8170 Processor
2.1 GHz
26
165 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Platinum 8168 processor
2.7 GHz
24
205 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Platinum 8165 processor
2.3 GHz
24
205 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Platinum 8164 processor
2.0 GHz
26
150 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Platinum 8160M Processor
2.1 GHz
24
150 W
3 @ 10.4 GT/s
2666 MT/s
1.5 TB
Platinum 8160 processor
2.1 GHz
24
150 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Platinum 8158 Processor
3.0 GHz
12
150 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Platinum 8156 processor
3.6 GHz
4
105 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Platinum 8153 processor
2.0 GHz
16
125 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold Processors
Gold Processor 6154
3.0 GHz
18
200 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold Processor 6152
2.1 GHz
22
140 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold 6150 processor
2.7 GHz
18
165 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold 6148 processor
2.4 GHz
20
150 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold 6146 processor
3.2 GHz
12
165 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold 6144 processor
3.5 GHz
8
150 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold Processor 6143
2.8 GHz
16
205 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold Processor 6142M
2.6 GHz
16
150 W
3 @ 10.4 GT/s
2666 MT/s
1.5 TB
Gold Processor 6142
2.6 GHz
16
150 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold 6140 processor
2.3 GHz
18
140 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold 6138 processor
2.0 GHz
20
125 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold 6136 processor
3.0 GHz
12
150 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold Processor 6134
3.2 GHz
8
130 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold Processor 6132
2.6 GHz
14
140 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold 6130 processor
2.1 GHz
16
125 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold Processor 6128
3.4 GHz
6
115 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold Processor 6126
2.6 GHz
12
125 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold Processor 5122
3.6 GHz
4
105 W
3 @ 10.4 GT/s
2666 MT/s
768 GB
Gold Processor 5120
2.2 GHz
14
105 W
3 @ 10.4 GT/s
2400 MT/s
768 GB
Gold Processor 5118
2.3 GHz
12
105 W
3 @ 10.4 GT/s
2400 MT/s
768 GB
Gold Processor 5115
2.4 GHz
10
85 W
3 @ 10.4 GT/s
2400 MT/s
768 GB
2nd Generation Intel Xeon Scalable Processor Family
Intel Xeon Models
CPU Frequency (GHz)
Cores
Power (WATTs)
DDR4 MT/s
Maximum memory per socket (TeraBytes)
Persistent memory support
Platinum Processors
Platinum 8280L processor
2.7 GHz
28 GHz
205 W
2933 MT/s
4.5 TB
yes
Platinum 8280M processor
2.7 GHz
28 GHz
205 W
2933 MT/s
2 TB
yes
Platinum 8280 processor
2.7 GHz
28 GHz
205 W
2933 MT/s
1 TB
yes
Platinum 8276L processor
2.2 GHz
28 GHz
165 W
2933 MT/s
4.5 TB
yes
Platinum 8276M Processor
2.2 GHz
28 GHz
165 W
2933 MT/s
2 TB
yes
Platinum 8276 processor
2.2 GHz
28 GHz
165 W
2933 MT/s
1 TB
yes
Platinum 8270 processor
2.6 GHz
26 GHz
205 W
2933 MT/s
1 TB
yes
Platinum 8268 processor
2.9 GHz
24 GHz
205 W
2933 MT/s
1 TB
yes
Platinum 8260Y processor
2.4 GHz
2.5 GHz
2.8 GHz
24 GHz
20 GHz
16 GHz
165 W
2933 MT/s
1 TB
yes
Platinum 8260L processor
2.4 GHz
24 GHz
165 W
2933 MT/s
4.5 TB
yes
Platinum 8260M processor
2.4 GHz
24 GHz
165 W
2933 MT/s
2 TB
yes
Platinum 8260 processor
2.4 GHz
24 GHz
165 W
2933 MT/s
1 TB
yes
Platinum 8256 processor
3.4 GHz
4 GHz
105 W
2933 MT/s
1 TB
yes
Platinum 8253 Processor
2.2 GHz
16 GHz
125 W
2933 MT/s
1 TB
yes
Gold Processors
Gold Processor 6262V
1.9 GHz
24 GHz
135 W
2933 MT/s
1 TB
yes
Gold Processor 6252N
2.3 GHz
24 GHz
150 W
2933 MT/s
1 TB
yes
Gold Processor 6254
3.1 GHz
18
200 W
2933 MT/s
1 TB
yes
Gold Processor 6252
2.1 GHz
24
150 W
2933 MT/s
1 TB
yes
Gold Processor 6248
2.5 GHz
20
150 W
2933 MT/s
1 TB
yes
Gold 6246 processor
3.3 GHz
12
165 W
2933 MT/s
1 TB
yes
Gold 6244 processor
3.6 GHz
8
150 W
2933 MT/s
1 TB
yes
Gold Processor 6242
2.8 GHz
16
150 W
2933 MT/s
1 TB
yes
Gold 6240Y processor
  • 2.6 GHz
  • 2.8 GHz
  • 3.1 GHz
  • 18
  • 14
  • 8
150 W
2933 MT/s
1 TB
yes
Gold 6240L processor
2.6 GHz
18
150 W
2933 MT/s
4.5 TB
yes
Gold Processor 6240M
2.6 GHz
18
150 W
2933 MT/s
2 TB
yes
Gold 6240 processor
2.6 GHz
18
150 W
2933 MT/s
1 TB
yes
Gold 6238L processor
2.1 GHz
22
140 W
2933 MT/s
4.5 TB
yes
Gold Processor 6238M
2.1 GHz
22
140 W
2933 MT/s
2 TB
yes
Gold Processor 6238
2.1 GHz
22
140 W
2933 MT/s
1 TB
yes
Gold Processor 6234
3.4 GHz
8
130 W
2933 MT/s
1 TB
yes
Gold Processor 6230N
2.3 GHz
20
125 W
2933 MT/s
1 TB
yes
Gold Processor 6230
2.1 GHz
20
125 W
2933 MT/s
1 TB
yes
Gold Processor 6226
2.7 GHz
12
125 W
2933 MT/s
1 TB
yes
Gold Processor 6222V
1.8 GHz
20
115 W
2933 MT/s
1 TB
yes
Gold Processor 5222
3.8 GHz
4
105 W
2933 MT/s
1 TB
yes
Gold Processor 5220S
2.6 GHz
18
125 W
2666 MT/s
1 TB
yes
Gold Processor 5220
2.2 GHz
18
125 W
2666 MT/s
1 TB
yes
Gold Processor 5218N
2.3 GHz
16
105 W
2666 MT/s
1 TB
yes
Gold Processor 5218B
2.3 GHz
16
125 W
2666 MT/s
1 TB
yes
Gold Processor 5218
2.3 GHz
16
125 W
2666 MT/s
1 TB
yes
Gold Processor 5217
3 GHz
8
125 W
2666 MT/s
1 TB
yes
Gold Processor 5215L
2.6 GHz
10
85 W
2666 MT/s
1 TB
yes
Gold Processor 5215M
2.6 GHz
10
85 W
2666 MT/s
1 TB
yes
Gold Processor 5215
2.6 GHz
10
85 W
2666 MT/s
1 TB
yes
Chipset
Chipset Intel C621 Series
HPE composer 2
Synergy Management

with OneView Technology
On the Compute Management Chipset 3
HPE iLO 5 ASIC
Memory 4, 5, 6, 7
HPE Registered Inline Dual Memory Module (RDIMMs) and Load Shedding Inline Dual Memory Module (LRDIMMs)
Two to forty-eight (48) of the following, depending on model. The following memory is compatible with the 2nd Generation Intel xeon Scalable processor family:
  • HPE 8GB (1 x 8GB) Single Rank x8 DDR4-2933 Memory Kit CAS-21-21-21 registered
  • HPE 16GB (1 x16GB) x4 DDR4-2933 Registered Memory Kit CAS-21-21-21
  • HPE 16GB (1 x 16GB) x8 DDR4-2933 Registered Memory Kit CAS-21-21-21
  • HPE 32GB (1 x 32GB) Dual Rank x4 DDR4-2933 Memory Kit CAS-21-21-21 registered
  • HPE 64GB (1 x 64GB) x4 DDR4-2933 RDIMM Memory Kit CAS-21-21-21 RDIMM
  • HPE 64GB (1 x 64GB) Quad Rank x4 DDR4-2933 Memory Kit CAS-21-21-21 LRDIMM
  • HPE 128GB (1 x 128GB) octal x4 DDR4-2933 CAS-24-21-21 LRDIMM Memory Kit
Model
HPE DDR4 SmartMemory, Registered (RDIMM), Low Load (LRDIMM)
Dual In-line Memory Module (DIMM) slots available
48
12 DIMM slots per processor, 6 channels per processor, 2 DIMMs per channel
Maximum capacity (LRDIMM)
6 TB
48 x 128 GB LRDIMM – 2666 MT/s (check availability of 128 GB DIMMs before ordering)
Maximum capacity (RDIMM)
3 TB
48 x 64 GB RDIMM – 2666 MT/s
The following memory is compatible with the 1st Gen Intel xeon Scalable processor family:
  • HPE 8GB (1 x 8GB) Single Rank x8 DDR4-2666 Memory Kit CAS-19-19-19 registered.
  • HPE 16GB (1 x 16GB) x4 DDR4-2666 Registered Memory Kit CAS-19-19-19.
  • HPE 16GB (1 x 16GB) x8 DDR4-2666 CAS-19-19-19 Registered Memory Kit.
  • HPE 32GB (1 x 32GB) x4 DDR4-2666 Registered Memory Kit CAS-19-19-19.
  • HPE 64GB (1 x 64GB) quad rank x4 DDR4-2666 CAS-19-19-19 LRDIMM Memory Kit.
  • HPE 128GB (1 x 128GB) octal x4 DDR4-2666 CAS-22-19-19 LRDIMM Memory Kit.
Model
HPE DDR4 SmartMemory, Registered (RDIMM), Low Load (LRDIMM)
Available DIMM slots
48
12 DIMM slots per processor, 6 channels per processor, 2 DIMMs per channel
Maximum capacity (LRDIMM)
6 TB
48 x 128 GB LRDIMM – 2666 MT/s (check availability of 128 GB DIMMs before ordering)
Maximum capacity (RDIMM)
1.5 TB
48 x 32 GB RDIMM – 2666 MT/s
Maximum capacity non-volatile inline dual memory module (NVDIMM)
192 GB
12 x 16 GB NVDIMM – 2666 MT/s
Modes of operation
New class of memory that can be configured as large server memory or fast storage.
  • Flexibility to deploy as dense memory or fast storage.
  • Single technology used as memory or storage, reducing data center complexity.
Memory Protection 8
Advanced ECC
Advanced ECC uses single-device data correction to detect and correct single and all-multi-bit errors that occur on a single DRAM chip.
Online spare
Memory Online Spare Mode detects a degrading grade and switches operation to the spare grade.
Online mode
Memory Online Spare Mode (Sorting Spare Mode).
Network Adapters 11
  • HPE Synergy 3820C 10/20GbE Converged Network Adapter (CNA)
  • HPE Synergy 2820C 10 GbE CNA
  • HPE Synergy 4820C 10/20/25Gb CNA
  • HPE Synergy 4610C 10/25 GbE Adapter
  • HPE Synergy 6810C 25/50 GbE Adapter
  • HPE Synergy 6410C 25/50 GbE Adapter
  • HPE Synergy 5330C 32G Fibre Channel (FC) Host Bus (HBA) Adapters
  • HPE Synergy 5830C 32G FC HBA
  • HPE Synergy 3530C 16G FC Host Bus Network Adapter
  • HPE Synergy 3830C 16G FC Host Bus Network Adapter
Mezzanine Connectors
Six (6) I/O expansion mezzanine connectors:
  • Mezzanine 1 connector is x16 PCIe 3.0 Type-D (supports Type-C and Type-D mezzanine cards) for Fabric 1.
  • The Mezzanine 2 connector is x16 PCIe 3.0 Type-D (supports both Type-C and Type-D mezzanine cards) for Mesh 2.
  • The mezzanine 3 connector is x16 PCIe 3.0 Type-C (supports Type-C mezzanine cards) for Mesh 3.
  • The 4 mezzanine connector is x16 PCIe 3.0 type D (supports both type C and type D mezzanine boards) for fabric 1.
  • The connector of mezzanine 5 is x16 PCIe 3.0 type D (supports mezzanine type C and type D cards) for fabric 2.
  • The mezzanine 6 connector is x16 PCIe 3.0 Type-C (supports Type-C mezzanine cards) for Mesh 3.
Mezzanine options include
  • 10/20 Gb dual-port compute module mezzanine adapter options.
  • Dual-port 16 Gb FC HBA for SAN connectivity.
  • 2GB storage module intelligent matrix mezzanine controller for direct-attached storage.
  • Dual-port 25/50GbE network adapter.
HPE Compute Module Read-Only Memory (ROM)
  • The HPE ROM is now digitally signed using HPE’s enterprise signing service. This signature is verified before the flashing process begins, reducing accidental programming and preventing malicious efforts to corrupt the system’s ROM.
  • The HPE Synergy compute ROM is used to configure the following:
    • Processor and chipset status loggers.
    • System memory, memory map, and memory initialization.
    • System hardware configuration (integrated PCI devices and optional PCIe cards).
    • End-user-specific BIOS configuration using the Unified Extensible Firmware Interface (UEFI) system utilities.
Inventory controllers
  • Software RAID (embedded): HPE Smart array S100i Gen10 Software RAID (HPE FIO enables intelligent array SW RAID).
  • Essential RAID Controllers: HPE Smart array E208i-c SR Gen10 12G SAS Modular Controller.
  • Performance RAID Controllers: HPE Smart array P408i-c SR Gen10 12G SAS Modular Controller.
    • HPE Smart array P416ie-m SR Gen10 12G SAS Mezzanine Controller (Mezzanine Hybrid Smart Array Controller for use with Synergy D3940 Storage Modules; up to 4 Storage Modules per frame with HPE Synergy 660 Gen10 Compute Modules).
  • HPE Smart array P416ie-m SR Gen10 12G SAS Mezzanine Controller (mezzanine hybrid smart array vontroller for use with Synergy D3940 Storage Modules; up to 4 storage modules per frame with HPE Synergy 660 Gen10 Compute Modules).
  • Premium rear panel compute module option for use with up to 4 NVMe drives in the front drive bay. In addition, it supports P416ie-m with specific SAS cable connections, allowing P416ie-m to manage SATA/SAS drives in front drive bay and HPE DAS storage SY D3940 module.
Maximum internal storage 9
Models Capacity
Configuration
Hot plug SFF SAS SSD
61.2 TB
4 x 15.3 TB
Hot plug SFF SATA SSD
15.36TB
4 x 3.84TB
Hot plug SFF SAS HDD
9.6 TB
4 x 2.4 TB
Hot plug SFF SATA HDD
8.0 TB
4 x 2.0 TB
Hot Plug SFF NVMe SSD
d16.0TB
8 x 4.0GB
Hot Plug uFF SATA SSD
2.72TB
4 x 340GB
Internal
M.2 Hot Plug

7.68TB
4 x 1.92TB
Interfaces
Slot Micro SDHC
One (1) internal high-capacity digital secure micro card slot (Micro SDHC).
USB 3.0 port
One (1) internal USB 3.0 connector for USB flash drive keys.
USB 3.0 port
One (1) external USB 3.0 connector for USB flash drive keys.
iLO USB 2.0 port
One (1) external USB 2.0 connector for iLO 5.
Form factor
The HPE Synergy 660 Gen10 is a single-width, full-height 10U compute module that connects to the HPE Synergy 12000 frame.
Frames
The HPE Synergy 12000 frame is the foundation for all Synergy products and supports full redundancy within a single frame, while enabling scalability and redundancy for many frames (up to 21 frames supported per single compositor/OneView).
  • Up to 12 half-height compute modules, 6 full-height single-width or 3 full-height double-width (combination allowed).
  • Up to 5 HP Synergy D3940 Storage Modules with Half-Height Double Width (combination with compute modules in any ratio allowed).
  • An HPE Synergy 12000 frame will support up to six (6) HPE Synergy 660 Gen10 Compute Modules.
Industry standard compliance
  • Microsoft logo certifications.
  • USB 3.0 compatible; iLO USB is compatible with 2.0.
  • WOL enabled on specific adapters.
  • PXE support enabled.
  • Trusted Platform Module (TPM) 2.0 support (TPM 1.2 RBSU support).
  • IEEE (specific IEEE standards depending on the installed Ethernet adapter card(s)).
  • Advanced encryption standard (AES).
  • Triple Data Encryption Standard (3DES).
  • SNMP
  • SSL 2.0
  • DMTF systems management architecture for server hardware command line protocol (SMASH CLP).
  • Active Directory v1.0
  • PCIe 3.0
  • UEFI Forum
Graphics
Integrated matrox G200eH2 video standard with 16 MB of video RAM
  • 1280 x 1024 (32 bp)
  • 1920 x 1200 (16 bp)
HPE iLO 5 in System Management Memory
  • Flash de 32 MB
  • 512 MB with ECC (224 MB after ECC and video).
HPE UEFI / ROM 10 Legacy Server
UEFI is an industry standard that provides better management and more secure configuration than legacy ROM when interacting with the user server at boot time. HPE Gen10 servers have a UEFI Class 2 implementation and support both UEFI (default) mode and legacy BIOS mode.
UEFI enables several new features specific to HPE Synergy compute modules, such as:
  • Secure boot and secure start allow for added security.
  • Operating system (OS)-specific functionality.
  • Support for 2.2 TB boot> drives (using GPT).
  • USB 3.0 battery
  • Embedded UEFI Shell
  • Bulk configuration deployment tool using iLO RESTful API compliant with Redfish API.
  • PXE boot support for IPv6 networks.
  • Workload profiles for simple performance optimization.
UEFI boot mode only:
  • TPM 2.0 support
  • NVMe boot support
  • Platform Trust Technology (PTT) can be enabled.
  • iSCSI software initiator support.
  • Support for HTTP/HTTPs initialization as a PXE alternative.
  • Boot support for option cards that only support an optional UEFI ROM.
Integrated management
USB 3.0

battery

  • HPE Synergy Composer with HPE OneView.
  • HPE iLO
  • UEFI
  • Intelligent
  • provisioning

  • iLO RESTful API
Safety
  • The latest forms of security based on the capabilities of iLO 5.
  • Secure start, with hardware root of trust.
    • The HPE hardware’s projected logic on the iLO chip validates the iLO firmware written on the chip.
    • iLO then validates the system firmware/ROM computing for digital signature.
    • iLO completes the chain of trust.
    • The ROM validates the ROMs option and the operating system bootloader via UEFI secure boot.
Standard security features
  • Startup password
  • Administrator password
  • Keypad Password (QuickLock)
  • HPE iLO management on the system management chipset with SSL encryption, Secure Shell version 2, AES and 3DES in the browser, CLP and XML script interface, AES and RC4 video encryption.
  • Enable/disable external USB port
  • Network Server Mode
  • Serial interface control
  • TPM 1.2 or 2.0 option
  • AES
  • Intel Advanced Encryption Standard-New Instructions (AES-NI).

NOTE:

  1. For more information on Intel Xeon processors,
  2. Read on and learn more about OneView.
  3. Read and learn more in iLO QuickSpecs
  4. The maximum capacity with LRDIMM will increase to 6 TB in 2H201.
  5. The 128GB LRDIMM, when available, cannot be mixed with other DIMM capacities/types.
  6. LRDIMM and RDIMM are distinct memory technologies and cannot be combined into one compute module.
  7. Previous generation HPE Server Memory (DDR3) is not supported on this compute module. HPE DDR4 SmartMemory is required to realize the memory performance enhancements and enhanced functionality listed in this document for Gen10.
  8. For details on the RAS feature of HPE Server memory options.
  9. The Synergy 660 Gen10 Compute Module includes HPE Hot-Plug SFF SmartDrive support for improved management and reduced maintenance errors. Previous generation (prior to Gen8) server HPE drives are not compatible with the Synergy 660 Gen9 or Gen10 drive bays.
    • For UEFI boot mode, the boot environment and operating system image installations must be configured correctly to support UEFI.
    • The UEFI FIO configuration (758959-B22) can be selected to configure the system in legacy mode at the factory for HPE Synergy Gen10 server users.
    • Supports full offload of FCoE storage protocol processing hardware for high-performance converged Ethernet data and storage networks.
    • Provides flexibility to compose multiple network streams, including ethernet and FCoE or iSCSI on each connection.
    • See Memory Quickspecs for more details.

Software Overview

Feature
Description
Operating system and virtualization software support
  • Microsoft Windows Server 2012 R2 Datacenter
  • Microsoft Windows Server 2012 R2 Standard
  • Microsoft Windows Server 2016 Standard Edition
  • Microsoft Windows Server 2016 Datacenter Edition
  • Microsoft Hyper-V Server 2012
  • Microsoft Hyper-V Server 2012 R2
  • Red Hat Enterprise Linux 6.9 (64-bit) (Includes KVM and RHEVH)
  • Red Hat Enterprise Linux 7.4 GA (64-bit) (Includes KVM and RHEVH)
  • SUSE Linux Enterprise Server 11 SP4 (64-bit) (Includes XEN and KVM)
  • SUSE Linux Enterprise Server 12 SP2 (64-bit) (Includes XEN and KVM)
  • SUSE Linux Enterprise Server 12 SP3 (64-bit) (Includes XEN and KVM)
  • VMware ESXi 6.0 U3 (VMWare vSphere 2015 U3)
  • VMware vSphere 2016
  • VMware vSphere 2017

NOTE: Operating system support may change. For the most up-to-date information, go to the HPE OS support matrix page:

Physical Specifications

Feature
Description
Dimensions (H x W x D) (with frame)
  • 6.35 x 43.03 x 59.92 cm (2.50 x 16.94 x 23.59 in)
Weight (approx)
  • Minimum: 13.75 kg (30.31 lb) – Two processors and 1 DIMM/processor installed
  • Maximum: 17.41 kg (38.38 lb) – All processors, 48 DIMMs, drives, mezzanine cards, and a flash cache battery installed

Electrical Specifications

Feature
Description
Power Specifications
For power specifications, including input, BTU rating, and power supply output requirements, refer to the HPE Synergy Frame TechSpecs.

Environmental Specifications

Feature
Description
System Inlet Temperature
Operating Temperature
  • 10° to 35 °C (50 ° to 95 °F) at sea level with an altitude reduction of 1.0 °C per 305 m (1.8 °F per 1000 ft) above sea level up to a maximum of 3050 m (10,000 ft), without sustained direct sunlight
  • The maximum rate of change is 20°C/h (36°F/h). The upper limit and rate of change may be limited by the type and number of options installed
  • System performance during standard operating support may be reduced if operating at fan failure or above 30°C (86°F)
Temperature out of operation
-30° to 60°C (-22° to 140°F). The maximum rate of change is 20°C/hr (36°F/hr)
Extended ambient operation support
For approved hardware configurations, the input range of the supported system is extended to be: 5° to 10°C (41° to 50°F) and 35° to 40°C (95° to 104°F) at sea level with an altitude reduction of 1.0°C per 175 m (1.8 °F per 574 ft) above 900 m (2953 ft) up to a maximum of 3050 m (10,000 ft)
Relative humidity (non-condensing)
Operating relative humidity
Minimum should be the highest (most humidity) of -12 °C (10.4 °F) dew point or 8% relative humidity. The maximum should be the lower dew point (less humidity) of 24 °C (75.2 °F) or 90% relative humidity
Relative humidity out of operation
5% to 95% relative humidity (Rh), maximum wet-bulb temperature of 38.7 °C (101.7 °F), non-condensing
Altitude
Operating Altitude
3050 m (10,000 ft). This value may be limited by the type and number of options installed. The maximum allowable altitude change rate is 457 m/min (1500 ft/min)
Non-operating altitude
9144 m (30,000 ft). The maximum allowable altitude change rate is 457 m/min (1500 ft/min)

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Third-Party Maintenance for HPE End-of-Life (EOL) and HPE End-of-Service-Life (EOSL)

DC Parts has analyzed more than 250 customer contracts using storage, servers, networks, and tapes and shown us that 40-60% of these customers’ equipment operates beyond their end-of-support dates.

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HPE Server Support

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