HPE Synergy 660 Gen10 CTO Compute Module

HPE Synergy 660 Gen10 CTO Compute Module – With warranty and technical service for installation or support.

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– SPARE PARTS AVAILABLE FOR EACH MODEL. CONSULT THE PRICE OF spare drives, controllers, power supplies, network cards, HBAs, SFPs, cables, etc.

Product Description HPE Synergy 660 Gen10

The HPE Synergy 660 Gen10 Compute Module delivers increased performance and scalability for your demanding data-intensive enterprise workloads. Powerful Intel® Xeon® Scalable family of processors (2 or 4 sockets), large memory footprint (up to 6TB of HPE DDR4 memory in 48 DIMM slots), and flexible I/O configuration deliver large workloads such as structured databases and business processing applications, the computing power and memory support they require.

What's New in HPE Synergy 660 Gen10
Next-generation processors from Intel's scalable family.
New 2933 MT/s memory for the next generation of Intel's scalable family of processors.
New HPE persistent memory optimized for data intensive workloads with Intel Optane DC persistent memory.
Additional drive systems and replacements.

Highly flexible – composite/software defined infrastructure
The HPE Synergy 660 Gen10 Computing Module offers more options for performance, capacity, efficiency and flexibility to power most workloads with support for the full range of 2 generations of scalable Intel Xeon family processors.
Composable compute resource that is intelligently auto-discovered, easily provisioned, and integratedly managed. Synergy Composability simplifies IT operations and reduces over-provisioning costs.

Integrated OneView – RESTful API with an ecosystem of combinable infrastructure partners ​​offers extensive options for third-party integration, protecting existing key investments.

Optimal performance for increasing workloads
The HPE Synergy Gen10 Computing Module offers a performance boost over the previous generation with a choice of 2 generations of scalable Intel family processors.
Increased memory speeds with a wide range of memory sizes for registered and off-load DDR4 DIMMs.
Faster compute for network connectivity speeds get your data where it's needed faster.

Flexible and Secure
The HPE Synergy 660 Gen10 Computing Module delivers superior enterprise-grade availability that enables IT to implement change quickly and confidently through model-based operations.
Unmatched threat protection with HPE Silicon Root of Trust and a unique chain of trusted architecture to protect, detect and recover firmware.
System tuning to create smooth performance while matching customer workloads
Up to 6 mezzanine options with enough I/O and redundancy for workloads that require high availability.
160 zoned drives per storage controller, framed and hybrid RAID / HBA Smart Array to make your controller investment more effective.

Características do produto

Feature
Overview
Processors 1
Two or four of the following depending on the model
Intel Xeon models
CPU Frequency (GHz) 
Core
Power (WATTs)
UPI
DDR4 MT/s
Memory per socket
Platinum Processors
8180M Platinum Processor
2,5 GHz
28
205 W
3 @ 10,4 GT / s
2666 MT/s
1,5 TB
Platinum 8180 Processor
2,5 GHz
28
205 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
Platinum 8176 Processor
2,1 GHz
28
165 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
Platinum 8170 Processor
2,1 GHz
26
165 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
Platinum 8168 Processor
2,7 GHz
24
205 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
Platinum 8165 Processor
2,3 GHz
24
205 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
Platinum 8164 Processor
2,0 GHz
26
150 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
8160M Platinum Processor
2,1 GHz
24
150 W
3 @ 10,4 GT / s
2666 MT/s
1,5 TB
Platinum 8160 Processor
2,1 GHz
24
150 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
Platinum 8158 Processor
3,0 GHz
12
150 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
Platinum 8156 Processor
3,6 GHz
4
105 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
Platinum 8153 Processor
2,0 GHz
16
125 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
Gold Processors
6154 Gold Processor
3,0 GHz
18
200 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6152 Gold Processor
2,1 GHz
22
140 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6150 Gold Processor
2,7 GHz
18
165 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6148 Gold Processor
2,4 GHz
20
150 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6146 Gold Processor
3,2 GHz
12
165 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6144 Gold Processor
3,5 GHz
8
150 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6143 Gold Processor
2,8 GHz
16
205 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6142M Gold Processor
2,6 GHz
16
150 W
3 @ 10,4 GT / s
2666 MT/s
1,5 TB
6142 Gold Processor
2,6 GHz
16
150 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6140 Gold Processor
2,3 GHz
18
140 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6138 Gold Processor
2,0 GHz
20
125 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6136 Gold Processor
3,0 GHz
12
150 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6134 Gold Processor
3,2 GHz
8
130 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6132 Gold Processor
2,6 GHz
14
140 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6130 Gold Processor
2,1 GHz
16
125 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6128 Gold Processor
3,4 GHz
6
115 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
6126 Gold Processor
2,6 GHz
12
125 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
5122 Gold Processor
3,6 GHz
4
105 W
3 @ 10,4 GT / s
2666 MT/s
768 GB
5120 Gold Processor
2,2 GHz
14
105 W
3 @ 10,4 GT / s
2400 MT/s
768 GB
5118 Gold Processor
2,3 GHz
12
105 W
3 @ 10,4 GT / s
2400 MT/s
768 GB
5115 Gold Processor
2,4 GHz
10
85 W
3 @ 10,4 GT / s
2400 MT/s
768 GB
Scalable Processor Family ​​Intel Xeon – 2nd Generation
Intel Xeon models
CPU Frequency (GHz) 
Core
Power (WATTs)
DDR4 MT/s
Maximum memory per socket (TeraBytes)
Persistent memory support
Platinum Processors
Platinum 8280L Processor
2,7 GHz
28 GHz
205 W
2933 MT/s
4,5 TB
yes
8280M Platinum Processor
2,7 GHz
28 GHz
205 W
2933 MT/s
2 TB
yes
Platinum 8280 Processor
2,7 GHz
28 GHz
205 W
2933 MT/s
1 TB
yes
Platinum 8276L Processor
2,2 GHz
28 GHz
165 W
2933 MT/s
4,5 TB
yes
8276M Platinum Processor
2,2 GHz
28 GHz
165 W
2933 MT/s
2 TB
yes
Platinum 8276 Processor
2,2 GHz
28 GHz
165 W
2933 MT/s
1 TB
yes
Platinum 8270 Processor
2,6 GHz
26 GHz
205 W
2933 MT/s
1 TB
yes
Platinum 8268 Processor
2,9 GHz
24 GHz
205 W
2933 MT/s
1 TB
yes
Platinum 8260Y Processor
2,4 GHz
2,5 GHz
2,8 GHz
24 GHz
20 GHz
16 GHz
165 W
2933 MT/s
1 TB
yes
Platinum 8260L Processor
2,4 GHz
24 GHz
165 W
2933 MT/s
4,5 TB
yes
8260M Platinum Processor
2,4 GHz
24 GHz
165 W
2933 MT/s
2 TB
yes
Platinum 8260 Processor
2,4 GHz
24 GHz
165 W
2933 MT/s
1 TB
yes
Platinum 8256 Processor
3,4 GHz
4 GHz
105 W
2933 MT/s
1 TB
yes
Platinum 8253 Processor
2,2 GHz
16 GHz
125 W
2933 MT/s
1 TB
yes
Gold Processors
6262V Gold Processor
1,9 GHz
24 GHz
135 W
2933 MT/s
1 TB
yes
Gold 6252N Processor
2,3 GHz
24 GHz
150 W
2933 MT/s
1 TB
yes
6254 Gold Processor
3,1 GHz
18
200 W
2933 MT/s
1 TB
yes
6252 Gold Processor
2,1 GHz
24
150 W
2933 MT/s
1 TB
yes
6248 Gold Processor
2,5 GHz
20
150 W
2933 MT/s
1 TB
yes
6246 Gold Processor
3,3 GHz
12
165 W
2933 MT/s
1 TB
yes
6244 Gold Processor
3,6 GHz
8
150 W
2933 MT/s
1 TB
yes
6242 Gold Processor
2,8 GHz
16
150 W
2933 MT/s
1 TB
yes
6240Y Gold Processor
  • 2,6 GHz
  • 2,8 GHz
  • 3,1 GHz
  • 18
  • 14
  • 8
150 W
2933 MT/s
1 TB
yes
6240L Gold Processor
2,6 GHz
18
150 W
2933 MT/s
4,5 TB
yes
6240M Gold Processor
2,6 GHz
18
150 W
2933 MT/s
2 TB
yes
6240 Gold Processor
2,6 GHz
18
150 W
2933 MT/s
1 TB
yes
6238L Gold Processor
2,1 GHz
22
140 W
2933 MT/s
4,5 TB
yes
6238M Gold Processor
2,1 GHz
22
140 W
2933 MT/s
2 TB
yes
6238 Gold Processor
2,1 GHz
22
140 W
2933 MT/s
1 TB
yes
6234 Gold Processor
3,4 GHz
8
130 W
2933 MT/s
1 TB
yes
Gold 6230N Processor
2,3 GHz
20
125 W
2933 MT/s
1 TB
yes
6230 Gold Processor
2,1 GHz
20
125 W
2933 MT/s
1 TB
yes
6226 Gold Processor
2,7 GHz
12
125 W
2933 MT/s
1 TB
yes
6222V Gold Processor
1,8 GHz
20
115 W
2933 MT/s
1 TB
yes
5222 Gold Processor
3,8 GHz
4
105 W
2933 MT/s
1 TB
yes
Gold 5220S Processor
2,6 GHz
18
125 W
2666 MT/s
1 TB
yes
5220 Gold Processor
2,2 GHz
18
125 W
2666 MT/s
1 TB
yes
Gold 5218N Processor
2,3 GHz
16
105 W
2666 MT/s
1 TB
yes
Gold 5218B Processor
2,3 GHz
16
125 W
2666 MT/s
1 TB
yes
5218 Gold Processor
2,3 GHz
16
125 W
2666 MT/s
1 TB
yes
5217 Gold Processor
3 GHz
8
125 W
2666 MT/s
1 TB
yes
5215L Gold Processor
2,6 GHz
10
85 W
2666 MT/s
1 TB
yes
5215M Gold Processor
2,6 GHz
10
85 W
2666 MT/s
1 TB
yes
5215 Gold Processor
2,6 GHz
10
85 W
2666 MT/s
1 TB
yes
chipset
Intel C621 Series Chipset
synergy management 2
HPE composer with OneView technology
On the compute management chipset 3
HPE iLO 5 ASIC
Memory 4, 5, 6, 7
HPE Registered Dual Inline Memory Module (RDIMMs) and Load Reduction Dual Inline Memory Module (LRDIMMs)
Two to forty-eight (48) of the following, depending on the model. The following memory is compatible with the 2nd generation geraçãoIntel xeon family of scalable processors:
  • HPE 8GB Memory Kit (1 x 8GB) Single Rank x8 DDR4-2933 Registered CAS-21-21-21
  • HPE 16GB Registered Memory Kit (1 x16GB) x4 DDR4-2933 CAS-21-21-21
  • HPE 16GB Registered Memory Kit (1 x 16GB) x8 DDR4-2933 CAS-21-21-21
  • HPE 32GB Memory Kit (1 x 32GB) Dual Rank x4 DDR4-2933 Registered CAS-21-21-21
  • HPE 64GB RDIMM Memory Kit (1 x 64GB) x4 DDR4-2933 CAS-21-21-21 RDIMM
  • HPE 64GB Memory Kit (1 x 64GB) Quad Rank x4 DDR4-2933 CAS-21-21-21 LRDIMM
  • HPE 128GB Memory Kit (1 x 128GB) octal x4 DDR4-2933 CAS-24-21-21 LRDIMM
Model
HPE DDR4 SmartMemory, registered (RDIMM), reduced load (LRDIMM)
Dual Inline Memory Module (DIMM) slots available
48
12 DIMM slots per processor, 6 channels per processor, 2 DIMMs per channel
Maximum Capacity (LRDIMM)
6 TB
48 x 128GB LRDIMM – 2666 MT / s (Please check availability of 128GB DIMMs before ordering)
Maximum Capacity (RDIMM)
3 TB
48 x 64 GB RDIMM – 2666 MT/s
The following memory is compatible with the 1st generation Intel xeon family of scalable processors:
  • HPE 8GB Memory Kit (1 x 8GB) Single Rank x8 DDR4-2666 Registered CAS-19-19-19.
  • HPE 16GB Registered Memory Kit (1 x 16GB) x4 DDR4-2666 CAS-19-19-19.
  • HPE 16GB Registered Memory Kit (1 x 16GB) x8 DDR4-2666 CAS-19-19-19.
  • HPE 32GB Registered Memory Kit (1 x 32GB) x4 DDR4-2666 CAS-19-19-19.
  • HPE 64GB Memory Kit (1 x 64GB) Quad Rank x4 DDR4-2666 CAS-19-19-19 LRDIMM.
  • HPE 128GB Memory Kit (1 x 128GB) octal x4 DDR4-2666 CAS-22-19-19 LRDIMM.
Model
HPE DDR4 SmartMemory, registered (RDIMM), reduced load (LRDIMM)
Available DIMM slots
48
12 DIMM slots per processor, 6 channels per processor, 2 DIMMs per channel
Maximum Capacity (LRDIMM)
6 TB
48 x 128GB LRDIMM – 2666 MT / s (Please check availability of 128GB DIMMs before ordering)
Maximum Capacity (RDIMM)
1,5 TB
48 x 32 GB RDIMM – 2666 MT/s
Full capacity non-volatile dual in-line memory module (NVDIMM)
192 GB
12 x 16 GB NVDIMM – 2666 MT/s
Modes of Operation 
New memory class that can be configured as large server memory or fast storage.
  • Flexibility to deploy as dense memory or fast storage.
  • Unique technology used as memory or storage, reducing data center complexity.
memory protection 8
Advanced ECC
Advanced ECC uses single-device data correction to detect and correct simple errors and all the multibits that occur on a single DRAM chip.
online spare
Online memory spare mode detects a rank that is degrading and switches the operation to the spare rank.
Online mode
Online memory spare mode (sorting spare mode).
Network adapters 11
  • HPE Synergy 3820C 10/20 GbE Converged Network Adapter (CNA)
  • HPE Synergy 2820C 10GbE CNA
  • HPE Synergy 4820C 10/20/25Gb CNA
  • HPE Synergy 4610C 10/25 GbE Adapter
  • HPE Synergy 6810C 25/50 GbE Adapter
  • HPE Synergy 6410C 25/50 GbE Adapter
  • HPE Synergy 5330C 32G Fiber Channel (FC) Host Bus Adapters (HBA)
  • HPE Synergy 5830C 32G FC HBA
  • HPE Synergy 3530C 16G FC Host Bus Network Adapter
  • HPE Synergy 3830C 16G FC Host Bus Network Adapter
Mezzanine Connectors
Six (6) mezzanine I/O expansion connectors:
  • Mezzanine connector 1 is x16 PCIe 3.0 type D (supports mezzanine cards type C and type D) for fabric 1.
  • Mezzanine connector 2 is x16 PCIe 3.0 Type D (supports Type C and Type D mezzanine cards) for Fabric 2.
  • Mezzanine Connector 3 is x16 PCIe 3.0 Type C (supports Mezzanine Type C cards) for Fabric 3.
  • Mezzanine connector 4 is x16 PCIe 3.0 type D (supports mezzanine cards type C and type D) for fabric 1.
  • Mezzanine 5 connector is x16 PCIe 3.0 type D (supports mezzanine cards type C and type D) for fabric 2.
  • Mezzanine Connector 6 is x16 PCIe 3.0 Type C (supports Mezzanine Type C cards) for Fabric 3.
Mezzanine options include
  • 10/20Gb Dual Port Computing Module Mezzanine Adapter Options.
  • Dual-port 16Gb FC HBA for SAN connectivity.
  • 2GB storage module smart array mezzanine controller for direct-attached storage.
  • Dual Port 25/50 GbE Network Adapter.
HPE Computing Module Read-only memory (ROM)
  • The HPE ROM is now digitally signed using HPE's corporate signature service. This signature is verified before the flash process starts, reducing accidental programming and preventing malicious efforts to corrupt the system ROM.
  • HPE Synergy compute ROM is used to configure the following:
    • Processor and chipset status registers.
    • System memory, memory map and memory initialization.
    • System hardware configuration (integrated PCI devices and optional PCIe cards).
    • End-user-specific BIOS configuration using Unified Extensible Firmware Interface (UEFI) system utilities.
Inventory controllers
  • Software RAID (built-in): HPE Smart Array S100i Gen10 software RAID (HPE FIO enables Smart Array SW RAID).
  • Essential RAID Controllers: HPE Smart Array E208i-c SR Gen10 12G SAS modular controller.
  • Performance RAID controllers: HPE Smart Array P408i-c SR Gen10 12G SAS modular controller.
    • HPE Smart Array P416ie-m SR Gen10 12G SAS Mezzanine Controller (Mezzanine Hybrid Smart Array Controller for use with Synergy D3940 Storage Modules; up to 4 storage modules per frame with HPE Synergy 660 Gen10 Computing Modules).
  • HPE Smart Array P416ie-m SR Gen10 12G SAS Mezzanine Controller (Mezzanine Hybrid Smart Array Vontroller for use with Synergy D3940 Storage Modules; up to 4 storage modules per frame with HPE Synergy 660 Gen10 Computing Modules).
  • Premium back panel compute module option for use with up to 4 NVMe drives in the front drive bay. In addition, it supports P416ie-m with specific SAS cable connections, allowing P416ie-m to manage SATA / SAS drives in front drive bay and DAS HPE SY D3940 storage module.
Maximum internal storage 9
Courts Models
Capacity
Configuration
Hot Plug SFF SAS SSD
61,2 TB
4 x 15,3 TB
Hot plug SFF SATA SSD
15,36 TB
4 x 3,84 TB
Hot Plug SFF SAS HDD
9,6 TB
4 x 2,4 TB
Hot Plug SFF SATA HDD
8,0 TB
4 x 2,0 TB
Hot Plug SFF NVMe SSD
d16.0TB
GB x 8 4,0
Hot Plug UFF SATA SSD
2,72 TB
GB x 4 340
Internal M.2 hot plug
7,68 TB
4 x 1,92 TB
Interfaces
Micro SDHC slot
One (1) built-in high capacity digital secure micro card slot (Micro SDHC).
3.0 USB port
One (1) internal USB 3.0 connector for USB flash media drive keys.
3.0 USB port
One (1) external USB 3.0 connector for USB flash media drive keys.
iLO USB 2.0 port
One (1) external USB 2.0 connector for iLO 5.
Form factor
The HPE Synergy 660 Gen10 is a full-height, single-width 10U compute module that connects to the 12000 frame of the HPE Synergy.
Frames
The HPE Synergy 12000 frame is the foundation for all Synergy products and supports full redundancy in a single frame, while allowing scalability and redundancy for many frames (up to 21 frames supported per single composer / OneView).
  • Up to 12 half-height, 6 full-height single-width, or 3 full-height double-width compute modules (combination allowed).
  • Up to 5 HPE Synergy D3940 Storage Modules with half-height double-width (combined with compute modules in any allowed ratio).
  • An HPE Synergy 12000 board will support up to six (6) HPE Synergy 660 Gen10 compute modules.
Industry standard compliance
  • Microsoft logo certifications.
  • Compatible with USB 3.0; iLO USB is 2.0 compliant.
  • WOL enabled on specific adapters.
  • PXE support enabled.
  • Trusted Platform Module (TPM) 2.0 support (RBSU support of TPM 1.2).
  • IEEE (specific IEEE standards depending on the installed Ethernet adapter(s) card(s)).
  • Advanced Encryption Standard (AES).
  • Triple Data Encryption Standard (3DES).
  • SNMP
  • SSL 2.0
  • DMTF systems management architecture for server hardware command line protocol (SMASH CLP).
  • Active Directory v1.0
  • PCIe 3.0
  • UEFI Forum
Graphics
Integrated matrox G200eH2 video standard with 16MB of video RAM
  • 1280x1024 (32bp)
  • 1920x1200 (16bp)
HPE iLO 5 in system management memory
  • 32 MB Flash
  • 512MB with ECC (224MB after ECC and video).
HPE UEFI Server / ROM 10 legacy
UEFI is an industry standard that provides better management and more secure configuration than legacy ROM when interacting with the user server at boot time. HPE Gen10 servers have a UEFI Class 2 implementation and support UEFI mode (default) and legacy BIOS mode.
UEFI enables several new features specific to HPE Synergy compute modules, such as:
  • Safe Start and Safe Start allow for greater security.
  • Operating system (OS) specific functionality.
  • Support for boot drives >2,2TB (using GPT).
  • USB 3.0 battery
  • Embedded UEFI shell
  • Bulk configuration deployment tool using iLO RESTful API compliant with Redfish API.
  • PXE boot support for IPv6 networks.
  • Workload profiles for simple performance optimization.
UEFI boot mode only:
  • TPM 2.0 support
  • NVMe boot support
  • Platform Trust Technology (PTT) can be activated.
  • iSCSI software initiator support.
  • Support HTTP / HTTPs boot as PXE alternative.
  • Boot support for option boards that support only a UEFI option ROM.
Integrated management
USB 3.0 battery
  • HPE Synergy Composer with HPE OneView.
  • HPE iLO
  • UEFI
  • Smart Provisioning
  • iLO RESTful API
Security
  • The newest forms of security based on the features of iLO 5.
  • Secure start, with root of hardware trust.
    • The HPE hardware's engineered logic on the iLO chip validates the iLO firmware written to the chip.
    • iLO then validates the system firmware / compute ROM for digital signature.
    • iLO completes the chain of trust.
    • The ROM validates the VIA UEFI secure boot OS ROMs and bootloader option.
Standard security features
  • Power-on password
  • admin password
  • Keyboard password (QuickLock)
  • HPE iLO management on system management chipset with SSL encryption, Secure Shell version 2, AES and 3DES in browser, CLP and XML script interface, AES and RC4 video encryption.
  • Enable / disable external USB port
  • network server mode
  • Serial Interface Control
  • TPM 1.2 or 2.0 option
  • BEA
  • Intel Advanced Encryption Standard-New Instructions (AES-NI).

NOTE:

  1. For more information on Intel Xeon processors, check the link below:Click here to access the Intel Xeon processors page
  2. Read and learn more about OneView at the link below:Click here to access the HPE OneView page .
  3. Read and learn more from iLO QuickSpecs at the link below:Click here to access the HPE Integrated Lights-Out (iLO) quickspecs page .
  4. Maximum capacity with LRDIMM will increase to 6TB in 2H201.
  5. 128GB LRDIMM, when available, cannot be mixed with other capacities / types of DIMM.
  6. LRDIMM and RDIMM are distinct memory technologies and cannot be combined in a compute module.
  7. Previous generation HPE server memory (DDR3) is not supported by this compute module. HPE DDR4 SmartMemory is required to realize the memory performance enhancements and enhanced functionality listed in this document for Gen10.
  8. For details on the HPE Server Memory Options RAS feature, check the link below:Click here to access the How Memory RAS Technologies Can Increase Uptime for HPE ProLiant Servers page .
  9. The Synergy 660 Gen10 Computing Module includes HPE Hot-Plug SFF SmartDrive support for improved manageability and reduced maintenance errors. HPE drives from previous generation servers (prior to Gen8) are not compatible with Synergy 660 Gen9 or Gen10 drive bays.
    • For UEFI boot mode, the boot environment and operating system image installations must be configured correctly to support UEFI.
    • The UEFI FIO setting (758959-B22) can be selected to configure the system in legacy mode at the factory for HPE Synergy Gen10 server users.
    • Supports full FCoE storage protocol processing hardware offload for high-performance converged Ethernet storage and data networks.
    • Offers flexibility to compose multiple network streams, including ethernet and FCoE or iSCSI on each connection.
    • See Memory Quickspecs for more details.

Software overview

Feature
Overview
Operating system and virtualization software support
  • Microsoft Windows Server 2012 R2 Datacenter
  • Microsoft Windows Server 2012 R2 Standard
  • Microsoft Windows Server 2016 Standard Edition
  • Microsoft Windows Server 2016 Datacenter Edition
  • Microsoft Hyper-V Server 2012
  • Microsoft Hyper-V Server 2012 R2
  • Red Hat Enterprise Linux 6.9 (64-bit) (Includes KVM and RHEVH)
  • Red Hat Enterprise Linux 7.4 GA (64-bit) (Includes KVM and RHEVH)
  • SUSE Linux Enterprise Server 11 SP4 (64-bit) (Includes XEN and KVM)
  • SUSE Linux Enterprise Server 12 SP2 (64-bit) (Includes XEN and KVM)
  • SUSE Linux Enterprise Server 12 SP3 (64-bit) (Includes XEN and KVM)
  • VMware ESXi 6.0 U3 (VMWare vSphere 2015 U3)
  • VMware vSphere 2016
  • VMware vSphere 2017

NOTE: the OS support may change. For the most up-to-date information, go to the HPE OS Support Matrix page:

Click here to access the server OS and virtualization software page .

Physical Specifications

Feature
Overview
Dimensions (H x W x D) (with frame)
  • 6,35 x 43,03 x 59,92 cm (2,50 x 16,94 x 23,59 in.)
Weight : (approximate)
  •  Minimum: 13,75 kg (30,31 lb) - Two processors and 1 DIMM / processor installed
  • Maximum: 17,41 kg (38,38 lb) - All processors, 48 ​​​​DIMMs, drives, mezzanine cards, and an installed flash cache battery

Electrical Specifications

Feature
Overview
Power Specifications
For power specifications, including input requirements, BTU rating, and power supply output, see the HPE Synergy Board TechSpecs.
To review typical system power ratings, use the HPE Power Advisor:

Environmental Specifications

Feature
Overview
System inlet temperature
Operating Temperature
  • 10° to 35°C (50° to 95°F) at sea level with an altitude reduction of 1,0°C per 305 m (1,8°F per 1000 ft) above sea level to a maximum of 3050 m (10.000 ft) without sustained direct sunlight
  • The maximum rate of change is 20°C/h (36°F/h). The upper limit and rate of change may be limited by the type and number of options installed.
  • System performance during standard operating support may be reduced if operating with fan failure or above 30°C (86°F)
Out of operation temperature
-30° to 60°C (-22° to 140°F). The maximum rate of change is 20°C/hr (36°F/hr)
Extended ambient operation support
For approved hardware configurations, the supported system input range is extended to be: 5° to 10°C (41° to 50°F) and 35° to 40°C (95° to 104°F) at the sea ​​with an altitude reduction of 1,0°C for every 175 m (1,8°F for every 574 ft) above 900 m (2953 ft) to a maximum of 3050 m (10.000 ft)
Relative humidity (non-condensing)
operational relative humidity
Minimum should be the highest (Most Humidity) of -12°C (10,4°F) dew point or 8% relative humidity. The maximum should be the lower dew point (less humidity) of 24 °C (75,2 °F) or 90% relative humidity
Relative humidity out of operation
5% to 95% relative humidity (Rh), maximum wet bulb temperature of 38,7 °C (101,7 °F), non-condensing
Altitude
Operating altitude
3050 m (10.000 ft). This value can be limited by the type and number of options installed. The maximum allowable altitude change rate is 457 m/min (1500 ft/min)
non-operational altitude
9144 m (30.000 ft). The maximum allowable altitude change rate is 457 m/min (1500 ft/min)
acoustic noise
Please check the link below for acoustic noise specifications:

 

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Third party maintenance for HPE End-of-Life (EOL) and HPE End-of-Service-Life (EOSL)

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Support services DC Parts support HPE appliances. We work to match the right approach with the right equipment to meet your HPE equipment support needs. With a highly trained team of certified engineers ready to resolve any issues with HPE equipment, DC Parts is uniquely qualified to serve you. If you would like to speak with a representative about purchasing HPE Equipment Support, please contact us. THE DC Parts helps companies of all sizes better manage their IT data centers by providing third-party support services to leading equipment manufacturers, including: IBM, HPE, DELL EMC, NETAPP and much more. With support DC Parts, we manage all your hardware, between the manufacturers through a link. Support from DC Parts offers flexible service level agreements, certified engineering support teams and dedicated customer service representatives. Extend the life and value of your IT assets. contact support DC Parts immediately.

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